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Dynamic CO2 Laser Marking Machine SCM2000

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Applicable Materials

Laser die cutting for PU heat transfer vinyl, PUFF heat transfer vinyl, Flock heat transfer vinyl, Luminous heat transfer vinyl, Reflective heat transfer vinyl, Silicone heat transfer vinyl, Laser heat transfer vinyl, Electroplate heat transfer vinyl, Printing reflective heat transfer vinyl, Glitter heat transfer vinyl

                           

Technical Parameters

Model

SCM2000

Worktable

Honeycomb Worktable

Laser Source Brand

 Coherent CO2 metal   RF Laser Tube   U.S.A.

Laser Source Model

C55

CX10L

J2

J3

Laser Output Power

55~65W

140~150W

240~250W

>350W

Marking Speed

≤4000mm/s

≤5000mm/s

≤7000mm/s

Max.Marking Area

 400x400mm

600x600mm

800x800mm

Laser Wavelength

10.64μm

Laser Frequency

1kHz~100kHz

Scanner

3D Dynamic Focusing Scanner  

Min Cutting Line Width

0.2 mm

Software

SUNIC 3X

File Formats

PLT, AI, BMP, JPG etc

Power Consumption

≤ 3 kWh

≤ 4 kWh

≤ 5 kWh

≤ 7 kWh

Power Supply

110V~380V/50Hz~60Hz

Cooling Way

Circulation Water Cooling

Equipment Dimension

1.1m*2.0m*2.0m

Equipment Weight

500KG

 

Benefits of Laser Cut

Quick turnoverwithout waiting for cutting die

Modular multi-function design

Save time, space, and labor cost

Optional CCD positioning function, more accuracy for printed vinyl cutting.

 

Why choose Dynamic CO2 Laser Marking Machine

Comparing with normal laser processing, dynamic CO2 laser marking machine processing is more fast and efficient.  Dynamic CO2 Laser Marking Machine adapts 30mm aperture size 3D dynamic focusing system, With the 3D high speed galvo system, more suitable for industrial heat transfer vinyl laser die cutting production.


Finer laser beam, better processing quality

Dynamic CO2 laser marking machine adapts high efficient and stable control system plus 3D galvo optical system, can realize finer and quality laser beam in the working area, min line width can reach to 0.2 mm


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