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Laser 3D Dynamic Model

Laser technology enables high-precision hole cutting and micro-perforation on packaging materials, making it an ideal choice for Vegetables, fruits, cakes, etc. box applications.The system ensures stable and continuous laser output, perfectly suited for dynamic production lines.The ARGUS laser system is custom-developed based on customer requirements and can be equipped with additional laser heads as needed to match the number of boxes on the production line.It features precise control over laser duration and power, maintaining tight tolerances throughout the entire process—even during machine starts, stops, and speed variations. This eliminates issues such as burrs or yellowed, melted edges around the holes, ensuring consistent, high-quality results across the entire production run.Compared with similar systems, it offers superior accuracy and efficiency, making it an ideal solution for advanced and innovative packaging applications.

Applications

Hole Cutting – Can be applied in regular or irregular patterns along the movement direction of the production line.
Mircro Perforation – Commonly used for food packaging boxes—such as for fruits, vegetables, pastries, and ready meals—to support better transport and preservation.

Efficient Processing

Customizable and integrable into workstation-based production lines, enabling fully automated loading and unloading to significantly boost production efficiency.

Argus Laser, the laser expert beside you, with 26 years of experience in laser equipment design and manufacturing, we provide more professional advice for your industrial technology improvement.

We are happy to provide you with the right laser solution for packaging boxes.

This series is designed for continuous or intermittent perforation and micro-perforation to enhance packaging box performance in transportation, preservation, and everyday storage.

MATERIALS
Plastic box

Kraft paper box

Bamboo fiber box

Corn starch box

Paper-plastic composite box

CAPABILITIES
Laser Hole Cutting

Laser Mircro Perforation

FEATURES & BENEFITS

Choosing a Laser Head Model for laser equipment has many benefits, and these are just some of them.

Customizable Equipment

Laser systems can operate as standalone units or be integrated into existing production lines

Various packaging materials

Capable of processing packaging materials in various shapes

Fixed laser head

Precise focus positioning, can be matched with the roll rotation speed

Laser light control

Select the light time according to the needs to achieve marking or drilling

Fully automated operation

Integrates with production lines for auto loading and unloading.

Exceptional perforation accuracy

High-precision positioning enables millimeter-scale micro-holes

Easy Traverse Positioning

Quickly and accurately locate the scoring or perforation position

Non-contact Processing

Eliminates inconsistencies associated with cutting tools and mechanical perforators

TECH SPECS

The technical specifications are based on baseline standards, but all laser equipment can be customized to meet your product requirements.

	3D Dynamic Head
Laser power	350 watts
Laser Source	Coherent CO2metal R.F. Laser source
Laser Wavelength	10.6μm
Laser Frequency	1kHz~100kHz
Max.Marking Area	700mm * 700mm
Flim perforation speed	≤15000mm/s
Repetition Precision	0.01mm
Cutting Line Width	0.1-0.5mm
Control System	ARGUS
Including	Customized mounting structure, Computer with software, Exhausting Fans, Air Pump
Power Supply	AC220/50Hz
Cooling Way	Air/Water Cooling
Multi-head	Avaible according to the request

**The above data may change due to product upgrades. For specific details, please contact us.

Contact Us To Get Competitive Price

Feel free to reach out to us anytime, day or night, via fax, email, or phone. Alternatively, you can use our quick contact form to inquire about our services. We're here to answer any questions you may have.

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