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The challenge of laser cutting machine

Views: 0     Author: Site Editor     Publish Time: 2022-05-25      Origin: Site

The challenge of laser cutting machine

Time and technology have brought us into a future where the cost and quality of laser marking, engraving and etching using newer laser technologies so far exceed the cost and quality of the product that the market for manufacturers is changing. High-precision laser marking and laser engraving on virtually any type of material, including gold, platinum, silver, brass, stainless steel, carbides, copper, titanium, aluminum, and a variety of medical-grade alloys and plastics. Non-contact laser marking is known for its durability, high temperature resistance, micro-coded laser marking that resists high and extreme heat applied to a variety of materials (meaning those tiny etched text won't degrade). The process does not include toxic solvents, inks or acids used on this biocompatible base metal. In contrast, other traceable marking methods, including: inkjet, hand engraving and dot pin marking, cannot always be expected to not fade, streamline or become indistinguishable over time. The wear and time-dependent vulnerability of non-laser-etched markings has become apparent to product engineering professionals. So much so that laser marking is often invoked for products with lifecycle traceability requirements. This inherent time-induced damage is why the non-contact laser marking process is changing how today’s routine etching and engraving are done. Whether you're looking to expand into new markets, trying to maintain an existing business or increasing your competitive advantage, choosing the right laser marking equipment with optimal performance is critical. LaserStar's fiber laser marking systems give you the edge you need to compete in today's high-value marketplace! The challenges of laser cutting: Overcoming some common obstaclesLaser cutting can leave a recast layer on the surface. Because lasers melt and burn some of the metal, remelted materials are deposited on the side of the cut edges and on the bottom of the cut. This layer of deposited materials is highly stressed and may crack, especially if it is an oxide. Although these cracks are small, they can propagate .

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