UV Laser Marking Machine adopts UV Laser source, the third-order cavity frequency doubling technology, compared with infrared laser, UV lasers at 355nm provide a small-size spot and a large depth of focus, marking by short wavelength laser interrupts molecular chains of material, can greatly reduces the mechanical deformation and temperature distortion of materials, it is a cold light, mainly used for super precise marking and engraving, particularly suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials, etc.
1.UV Laser Marking Machine is mainly used in precision processing of high-end market, handicrafts, medicine, cosmetics, video and other polymer materials packaging bottle, the mark is very precise and stands wear, better than ink printing and pollution-free;
2. The flexible PCB marking and scribing, silicon and wafer micro hole, blind hole processing;
3. LCD glass QR code marking, glass wares punching, metal surface coating marking, plastic buttons, communications equipment, electronics, gifts, building materials and so on.
UV Laser Marking Machine adopts UV Laser source, the third-order cavity frequency doubling technology, compared with infrared laser, UV lasers at 355nm provide a small-size spot and a large depth of focus, marking by short wavelength laser interrupts molecular chains of material, can greatly reduces the mechanical deformation and temperature distortion of materials, it is a cold light, mainly used for super precise marking and engraving, particularly suitable for food, pharmaceutical packaging material marking, micro porous, high-speed dividing for glass, complex graphics wafer cutting on silicon materials, etc.
1.UV Laser Marking Machine is mainly used in precision processing of high-end market, handicrafts, medicine, cosmetics, video and other polymer materials packaging bottle, the mark is very precise and stands wear, better than ink printing and pollution-free;
2. The flexible PCB marking and scribing, silicon and wafer micro hole, blind hole processing;
3. LCD glass QR code marking, glass wares punching, metal surface coating marking, plastic buttons, communications equipment, electronics, gifts, building materials and so on.