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SCU6070

| Model | LCP6070 |
| Work Area | 600*700mm |
| Laser Source | Infrared Picosecond Laser Source |
| Pulse Width | <15ps |
| Average Output Power | 60W |
| Platform Stroke | Custom XY linear module, maximum stroke 600mm × 700mm, dual station platform system |
| Platform Speed | 1200mm/s |
| Platform Accuracy | Positioning accuracy ±2μm |
| Maximum cutting thickness | 20mm |
| Cutting Product Types | Glass and transparent materials such as Corning, Schott, Panda, optical filters, etc |
| Spot Distance | Adjustable from 1μm to 10μm |
| Cutting Product Features | Cutting effect: Clean, smooth edges with a chip size ≤5μm after splitting |
| Control System | Industrial PC: Dual-core CPU; 8GB RAM; 500GB Hard Drive; with LCD monitor |
| Control Software | Dedicated glass laser cutting software |
| Equipment Dimensions | Length 2400mm × Width 2100mm × Height 1950mm |

| Model | LCP6070 |
| Work Area | 600*700mm |
| Laser Source | Infrared Picosecond Laser Source |
| Pulse Width | <15ps |
| Average Output Power | 60W |
| Platform Stroke | Custom XY linear module, maximum stroke 600mm × 700mm, dual station platform system |
| Platform Speed | 1200mm/s |
| Platform Accuracy | Positioning accuracy ±2μm |
| Maximum cutting thickness | 20mm |
| Cutting Product Types | Glass and transparent materials such as Corning, Schott, Panda, optical filters, etc |
| Spot Distance | Adjustable from 1μm to 10μm |
| Cutting Product Features | Cutting effect: Clean, smooth edges with a chip size ≤5μm after splitting |
| Control System | Industrial PC: Dual-core CPU; 8GB RAM; 500GB Hard Drive; with LCD monitor |
| Control Software | Dedicated glass laser cutting software |
| Equipment Dimensions | Length 2400mm × Width 2100mm × Height 1950mm |